TM 1-5855-265-20
3-16
3-5. CORROSION INHIBITIVE SEALING AND COATING COMPOUND REMOVAL, APPLICATION,
AND CURING (cont)
c. Class 2 application - apply compound over
all bonding hardware. Extend coating to
cover an area 1 1/2 times diameter of
sanded area.
NOTE
Remove excess uncured compound using a
cloth and acetone or toluene.
CURING
NOTE
Assemblies using class 1 application may be
handled immediately after completion of
assembly. Assemblies using class 2 may be
handled when compound becomes tack-free
to touch.
10. Cure compound for 30 hours at 67 to 87°F
(19.4 to 30.5°C).
END OF TASK
SEE NOTE 1
NOTES:
1. SANDED AREA
2. HARDWARE AND AREA COATED WITH COMPOUND
(1-1/2 TIMES DIAMETER OF SANDED AREA.)
300-164
SEE
NOTE 2